CPU Xeon, i9,i7,i5,i3 Gen.10
2x LAN
6x USB 3.2
2x USB 2.0
2x COM
1x PS/2
1x HDMI 4096x2160 at 30Hz
2x DisplayPort 4096x2304@60Hz (according to CPU specifications)
1 x VGA
3 x full-size Mini-PCIe connectors
2 x SIM slots
4 x CMI interface: different I/O moduls see picture
1 x CFM IGN Interface need to be ordere separately
2 x PCI/PCIe slots
Vibration/Shock MIL-STD-810G
CE, UKCA, FCC, ICES-003 Class A, EN50121-3-2 (Rail), IEC/EN 62368-1
REQUEST about additional information with details
This PC series has a rich selection of native high-speed I/O such as 2× GbE LAN, 6× USB3.2, and more, that connect to the cameras and sensors required by the VGR for high-speed high-resolution data transmission. Special exclusive modules provide further I/O or function expansion options, such as GbE LAN, 10GbE LAN, DIO, COM, USB 3.2, or PoE. The built-in Mini PCIe expansion slot can be used with commercially available Wi-Fi/4G/GPS modules for wireless communication and upload of production information to the central control center in real-time.
VGRs are used in the harsh and complex environment of industrial manufacturing sites. All PCes in this series are designed to withstand shock and vibration, meeting the industry-leading US military equipment inspection standard (MIL-STD-810G), and maintaining the rugged design, with protection mechanisms such as wide temperature (-40–70°C) and wide voltage (9–48 VDC) support, and overvoltage, overcurrent, and ESD protection. Regardless of the working environment temperature, they can operate uninterrupted for a long time, providing the most stable and reliable performance for VGR edge computing.
Intel® Xeon® Series Processor ( 80W / 35W ):
• Intel® Xeon® W-1270E 8 Cores Up to 4.8 GHz, TDP 80W
• Intel® Xeon® W-1250E 6 Cores Up to 4.7 GHz, TDP 80W
• Intel® Xeon® W-1290TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Xeon® W-1270TE 8 Cores Up to 4.4 GHz, TDP 35W
• Intel® Xeon® W-1250TE 6 Cores Up to 3.8 GHz, TDP 35W Intel® Core® Series Processor ( 65W / 35W ):
• Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W
• Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W
• Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W
• Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W
• Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W
• Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W
• Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W
Fuldt bestykket industri PC, 5 x gigabit netværk, u/OS.
11th Gen. Intel® i7 CPU (Optional: i3, i5)
2 x 260-pin DDR4 SO-DIMM (64GB Max)
1 x M.2 M-Key, 1 x 2.5” HDD/SSD
16 x I/O, 4 x COM, 3 x LAN(2xPoE), 4 x USB3.1, Remote PWR
Video output: DVI-D, HDMI, DP
Mounting: Wall-mount (Option: DIN-rail or VESA)
Power Input: 9~36 VDC
Dimensioner: 210x180x70mm (WxDxH)
Operating Temp.-10 ~ 60 °C With airflow
Supports 9/8. Gen Intel® Core / Pentium® / Celeron® 8 Core 35W / 65W LGA 1151 CPUs
2x DDR4 SO-DIMM, supports up to 2666MHz, max 64GB
1x DVI-I and 2X DP (4K resolution)
1x M.2 2280 M Key Socket, auto-detection for PCIex4 NVMe SSD or SATA Gen3 SSD
2x Front available SIM slot
2X PCIe slots (standard) / 2X PCI (option) for add-on cards (maximum length: 235 mm)
Operating temperature -40 ° C to 70 ° C
EN50121-3-2 Certified / LVD EN62368-1
9 ~ 48VDC via 3-pin Terminal Block
Built-in fanless PC with a focus on vision solutions
9th generation Intel Core i7/i5/i3 processors
Q370 Chipset
2 x RJ45 Gbit
Supports DDR4 (2666MHz) SO-DIMM up to 64GB
2 x 2½" SATA3 HDD/SSD
VGA, HDMI
1x GPU extension max 75Wattx
Supports comprehensive GPU card (75W) expansion
Wall bracket / DIN bracket
Flexible expandability through I/O module design
Power input 9~36DC
Dimensions 222x190x77 (depending on model/version)
Other models are available with PCIex expansion and PCI expansion
